NEW TAIPEI CITY, Taiwan – Hon Hai Technology Group, more commonly known as Foxconn, on Thursday announced a strategic collaboration with Intel to jointly accelerate the development and deployment of next-generation artificial intelligence infrastructure and intelligent computing platforms.
By combining Intel’s strengths in processor architecture, silicon technologies and software ecosystem with Foxconn’s global manufacturing scale, system integration expertise and AI data center deployment capabilities, the two companies will explore comprehensive AI solutions spanning silicon, rack, system and application layers, the company said. The collaboration also aims to accelerate the large-scale deployment of AI-driven technologies across edge and physical AI applications.
“AI is rapidly transforming industries and society worldwide. Through our ‘3+3+3’ strategy, Foxconn continues to advance key technologies including AI, semiconductors and next-generation communications, while driving the development of our three core platforms: smart manufacturing, smart EV and smart city,” said Young Liu, Chairman and CEO of Hon Hai Technology Group.
“Our collaboration with Intel will combine the strengths of both companies across computing platforms, system integration and global supply chain capabilities to jointly build next-generation AI infrastructure, edge AI and physical AI ecosystems, accelerating the adoption of AI applications worldwide,” he said.
Under the collaboration framework, Intel and Foxconn will work together to scale AI-driven solutions by leveraging Intel’s computing platforms, silicon technologies and software ecosystem together with Foxconn’s system integration capabilities, manufacturing expertise and global customer reach.
“The rapid growth of AI – especially in inference and agentic workloads at scale – is redefining what modern computing must deliver,” said Lip-Bau Tan, Intel CEO. “These demands require innovation across the full stack – from new silicon and chip design to rackscale systems and extending all the way to edge and physical AI deployments. Our collaboration with Foxconn brings together two innovation leaders with deep expertise in chip design, rack-scale solutions and global systems integration. Together, we are accelerating the delivery of end-to-end platforms that unlock new capabilities and extend the impact of AI worldwide.”
In the AI Rack domain, the two companies will explore the development and commercialization of rack-scale AI infrastructure solutions, including Intel Xeon-based CPU racks and AI accelerator architectures. The collaboration will also focus on advancing high-speed interconnect technologies, thermal and liquid cooling designs, system telemetry and AI data center scalability to deliver high-performance, energy-efficient AI deployment solutions.
Intel and Foxconn will jointly define next-generation edge AI and physical AI platform architectures, targeting emerging applications such as agentic AI, edge intelligence and robotics. The collaboration will further promote and support diverse applications across smart manufacturing, smart cities, automotive and robotics.
In addition, the two companies will explore opportunities in design services, including custom ASICs, SoCs and system integration solutions. By combining Intel’s end-to-end silicon capabilities with Foxconn’s comprehensive design and manufacturing ecosystem, the collaboration spans silicon, modules and systems to address global market opportunities.
No additional details on the partnership were disclosed.
Foxconn is currently renovating space at the former General Motors Co. Lordstown plant to accommodate production of components used in AI data centers. The project is part of a partnership between OpenAI and SoftBank Group, which acquired the Lordstown plant from Foxconn last year for $375 million.
According to press reports published in November, SoftBank plans to invest up to $3 billion in Lordstown to manufacture equipment for OpenAI’s data centers.
According to the reports, the Lordstown plant would manufacture components for AI data centers in Milam County, Texas, and other locations.
Also Thursday, Foxconn said it would collaborate with OpenAI to engineer data center racks, components and other hardware used in artificial intelligence systems.
Pictured at top: Foxconn Chairman Young Liu and Intel CEO Lin-Bu Tan.